Back Grinding Wheel for Silicon Wafer Surface
Home » Super Abrasives Tools » Super Abrasive Wheels » Vitrified Bond Tools » Back Grinding Wheel for Silicon Wafer Surface

loading

Back Grinding Wheel for Silicon Wafer Surface

Availability:
Quantity:

PDF Export

facebook sharing button
twitter sharing button
line sharing button
linkedin sharing button
pinterest sharing button
whatsapp sharing button
sharethis sharing button


Feature: Reduced Edge Chipping,Low Surface Damage,Excellent Flatness Control


Shape

D

T

H

Grits

Concentration

6A2

254 mm

30.5 mm

190 mm

2000#,

5000#

7000#

8000#

30000#

75

100

125

150

200

255 mm

38 mm

95 mm

255 mm

34 mm

155 mm

209 mm

24.5 mm

158 mm

312 mm

32 mm

237 mm



Henan Yalong Superhard Materials Co., Ltd. has specialized in super abrasive fields for over 30 years. 

Quick Links

Product Category

Contact us
Copyright © 2023 Henan Yalong Superhard Materials Co., Ltd. All rights reserved. Sitemap Support by leadong.com Privacy Policy