Views: 0 Author: Site Editor Publish Time: 2025-03-21 Origin: Site
Diamond micropowder, as a core material in the superhard industry, directly impacts the performance of high-end applications including precision machining, electronic devices, and optical coatings. This article systematically analyzes five critical quality indicators governing diamond micropowder quality and their decisive influence on end-use applications.
1. Particle Size Distribution: The Foundation of Precision
(1) Correlation between D50 value and surface roughness: In semiconductor wafer dicing, a 0.2μm D50 deviation increases edge burr rates by 15%
(2) Span value control: High-end tool coatings require Span ≤0.8
(3) Impact of oversized particles: A single 50μm particle raises CMP pad scratch rates by 30x
2. Particle Morphology: The Geometric Determinant
(1) Sphericity and flowability: Micropowder with >85% sphericity improves 3D printing layer uniformity by 40%
(2) Angularity index and cutting efficiency: Octahedral crystals show 2.3x higher grinding efficiency than cubic forms
(3) Surface defect cascading effects: Microcracks reduce resin-bonded tool lifespan by 60%
3. Chemical Composition: The Purity Imperative
(1) Metal impurity thresholds: Fe content >200ppm induces leakage currents in semiconductor devices
(2) Surface functionalization: Carboxylation enhances epoxy resin adhesion by 75%
(3) Ash content standards: PV glass coating requires ash ≤0.05%
4. Mechanical Properties: Dual Aspects of Strength
(1) Single-particle compressive strength: MBD8-grade requires >90% retention rate for PDC drill bits
(2) Bulk strength distribution: RVD-type micropowder must maintain <5% fracture rate
(3) Thermal stability: Strength degradation should be <15% after 800℃ treatment
5. Application-Specific Parameter Matrix
(1) Precision grinding: 0.5-2μm size + >90% sphericity + TI >85
(2) Thermal interface materials: 5-8m²/g BET surface area + <0.5wt% oxygen
(3) Military coatings: <50ppm magnetic content + >95% monocrystal rate
